PVSK Tandem Double Cluster System
KOREA KIYON’s Perovskite Tandem Cluster System is capable of handling large-area G12 (210 mm × 210 mm) substrates. It consists of a perovskite solar cluster tool designed to absorb wavelengths below 850 nm, and a CIGS cluster tool designed to absorb wavelengths between 800 and 1100 nm
- Integrated Deposition System for Full Processing of CIGS–Perovskite Tandem Structures
- Optimized deposition methods for each layer ensure high efficiency and process flexibility.
- Double cluster and double load-lock chamber configuration maximize productivity, with full automation and individual chamber control.
- Selenium (Se) trap device in the CIGS chamber prevents contamination of other chambers and pumps.
- Perovskite deposition chambers are divided into organic halide chambers (MAI, FAI) and metal halide chambers (PbI₂, SnI₂).
- Equipped with an in-situ monitoring system for real-time measurement of perovskite formation during deposition.
KK-CU/GB-210-TSC
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ApplicationPerovskite Solar Cell, OLED Display, Li-ion Battery, Semiconductor
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Sample SizeMax 210mm x 210mm (G12)
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Process Module
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CIGS Cluster
- Metal Sputter (Mo)
- CIGS Evaporator (Cu, In, Ga, Se Cell + Low Temp cell) /
Se Trap Module (Hot & Cold Trap / Pumping Flow Trap) - TCO Sputter Module (Plasma Damage Free System)
- ALD (Thermal Type, Zinc Deposition)
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PVK Cluster
- PVK Evaporator Module (Substrate Cooling & Heating (-25℃ ~150℃)) /
In-Situ Monitoring Tool Inside Wall Cooling and Corrosion Protection Special Coating - CTL Evaporator (Low Temp cell)
- Metal Evaporator (Boat Source + High Temp cell)
- ALD (Thermal Type, SnO Deposition)
- PVK Evaporator Module (Substrate Cooling & Heating (-25℃ ~150℃)) /
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CIGS Cluster
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Deposition Source
- PVK: Effusion Cell Source (Low Temp)
- CTL Effusion Cell Source (Hi-Temp + Low Temp)
- Sputter: RF & DC Sputter (ITO, Mo Deposition)_ Plasma damage free
- ALD: DOT (Dioctyltin) + H2O , 3 canister + 1reactants
DEZ (Diethylzinc) + H2O , 3canister + 1reactants - CIGS: Cu, In, Ga, Se Cell (75cc) + Low Temp Cell
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Glovebox
- Double Side Glovebox
- Dry Process Zone: Connecting Cluster System
- Wet Process Zone: Slot Die Coater Integration
- Dual Purification System
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System Control
- Full Auto Control: PC Control
- Program: Visual Basic + PLC Program
- Rate Control: Feedback Rate Control (5A ~ 0.1A Rate Control)
- 4~5 Source Co-depo Control
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Key Spec.
- 210mm x 210 mm (G12 Sample)
- Substrate Cooling & Heating (-25℃ ~150℃)
- Se Trap Module
In-Situ Monitoring Tool (EL / PL / Bandgap Energy real-time measurement) - 4~6 Source Co-Depo Control / Plasma Damage Free TCO Layer
- Auto Filp Module for ALD Process
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Email: [accounting@koreakiyon.com]
Mailing Address: [486 Seobusaetgil Geumcheongu Seoul, South Korea 08588]
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